How Does Rework Factor Into Circuit Board Assembler Processes?
Rework Factor Into Circuit Board Assembler Processes
A circuit board assembler is responsible for the assembly of printed circuit boards that are used in a variety of applications. They must carefully handle each component to ensure it is placed in the correct location. They also must ensure all parts are working properly and that there is no contamination. Depending on the type of components and the circuit board design, there are a variety of different processes that must be followed. As a result, it is very important for a circuit board assembler to have good process control and training to ensure they can work safely and efficiently.
Rework factor into circuit board assembler processes because there are times when the original board needs to be repaired or replaced due to manufacturing defects or quality issues. This typically involves de-soldering or re-soldering on the board of some surface-mounted and through-hole components. The rework process is very time-consuming and expensive since it cannot be mass-produced as the PCB production line can. However, rework is crucial to ensure the final product meets all quality and performance standards set by the customer.
During the rework process, a circuit board assembler must be able to heat up a local area of the board without damaging surrounding components. This requires careful planning and documenting all processes to ensure rework is done correctly. This helps to prevent errors that could cause a failure in the final product.
How Does Rework Factor Into Circuit Board Assembler Processes?
One key to successful rework is to use the proper tools. Typical tools include soldering irons, desoldering wicks, and cleaning solutions. The cleaning chemicals help to remove oxidation and encourage proper wetting of new solder. The soldering irons should be calibrated to match the temperature of the reflow process to avoid damage to sensitive components.
Another challenge is the amount of space on a circuit board for tools. Small, delicate components such as 0805 passives can be hard to reach with a soldering iron and can easily get damaged if they are not positioned properly. In addition, there may not be room to maneuver the soldering iron around other components if they are in close proximity.
Reflow and cooling of the reworked circuit board are also critical for success. Slow cooling can cause unwanted precipitation of lead, weaken the grain structure, and reduce solder strength. It is also important to have a rapid cooling system that can be integrated into the reflow process to save time.
Using a BOM or bill of materials can also help to speed up the rework process. A BOM provides a comprehensive list of all necessary components that are required to move forward with the process. This can be especially helpful if a rework procedure is new or unfamiliar to the assembler. Using a BOM will help to avoid any surprises when it comes to purchasing or receiving the necessary components for the rework process. It can also eliminate confusion on which part number should be used for each item. A good BOM also allows rework operators to keep track of all their products and supplies that are needed to perform the rework process.